December 19, 2014

Samsung rumored to build LTE into next-gen Exynos chipset

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Samsung’s much-anticipated Galaxy S III may be the first smartphone to have LTE connectivity built directly into the processor, according to new reports.  Korea Times is advising that Samsung has a quad-core chipset shipping with both LTE and HSPA 3G inside.

Not only would this help to keep the Galaxy S III and other future devices thin, it could also go a long way to reduce battery consumption.  According to the anonymous Korea Times source, Samsung believes that Qualcomm was “gradually losing its edge” in the processor war.  Further, the secretive executive indicates that Samsung is looking to consolidate as much hardware as they can.

Unfortunately we still don’t know for certain when it is that the Galaxy S III is expected to make its debut.  We’ve heard everything from March-June over the last few months so your guess is as as ours.  Considering that the Galaxy S II is still selling like hotcakes, it stands to reason that Samsung is in no hurry to cannibalize sales.

Via: Electronista